Crystal Bonding- Inosanganiswa Technology yeLaser Crystals
Product Description
Kukosha kwekushandiswa kwekombiki yekubatanidza pamakristasi e-laser iri mu: 1.Miniaturization uye kubatanidzwa kwemasikisi emagetsi / maitiro, akadai seNd: YAG / Cr: YAG bonding yekugadzirwa kwepassive Q-switched microchip lasers; 2. Kuvandudza kugadzikana kwekupisa kwelaser rods Performance, yakadai seYAG / Nd: YAG / YAG (kureva kuti, yakasungwa neYAG yakachena kuti igadzire iyo inonzi "end cap" kumativi ose maviri e laser rod) inogona kuderedza zvakanyanya kukwira kwekushisa kwekuguma kwechiso cheNd: YAG tsvimbo kana iri kushanda, inonyanya kushandiswa semicostate lasers uye yakasimba-yakasimba lasers. kushanda.
Yedu yekambani yazvino yeYaG yakatevedzana yakasungirirwa zvigadzirwa zvekristaro zvinosanganisira: Nd: YAG uye Cr4 +: YAG yakasungwa tsvimbo, Nd: YAG yakasungwa neyakachena yakachena pamagumo ese, Yb: YAG uye Cr4 +: YAG yakasungwa tsvimbo, nezvimwewo; madhayamita kubva Φ3 ~ 15mm, kureba (ukobvu) kubva 0.5 ~ 120mm, anogona zvakare kugadziriswa kuita masikweya mitsetse kana masikweya mapepa.
Bonded crystal chigadzirwa chinosanganisa laser crystal neimwe kana maviri akachena asina-doped homogeneous substrate zvinhu kuburikidza ne bonding tekinoroji kuti uwane yakagadzikana musanganiswa. Ongororo dzinoratidza kuti makristasi ekubatanidza anogona kunyatso kudzikisa tembiricha yelaser makristasi uye kuderedza pesvedzero yekupisa lens mhedzisiro inokonzerwa nekuguma kwechiso deformation.
Features
● Kuderedza kupisa kwekushisa kunokonzerwa nekuguma kwekugadzirisa chiso
● Kuvandudza chiedza chekushandura chiedza
● Kuwedzera kushorwa kune photodamage chikumbaridzo
● Kuvandudzwa kwelaser kubuda danda kunaka
● Saizi yakaderedzwa
Flatness | <λ/10@632.8nm |
Surface quality | 10/5 |
Parallelism | <10 arc seconds |
Verticality | <5 arc maminetsi |
Chamfer | 0.1mm@45° |
Coating layer | AR kana HR coating |
Optical quality | Mipendero yekukanganisa: ≤ 0.125/inch Kukanganisa mipendero: ≤ 0.125/inch |